Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer

摘要

Semiconductor module comprises a housing (1) closed on one side by a metallic heat conducting base (2) which is connected to a metallic coated, electrically insulating heat conducting ceramic layer (3) via a solder layer (4). A semiconductor element (7, 8) is arranged on the inside. The base is formed as a cooling body (9) which is structured to deviate losses from the module by forced cooling using a cooling fluid. Preferred Features: The base is made from copper. The cooling body is provided with cooling ribs and has channels for guiding the cooling fluid. The ceramic layer is made from aluminum oxide, aluminum nitride, silicon nitride, silicon carbide or beryllium oxide.