| 摘要 |
The present invention provides an electrical device connection terminal capable of preventing improper insulation owing to lead wire chips being dropped and built up. To attain this feature, a side wall 26 for separating a lead wire holding portion 25 from a lead fitting 43 is projected on the bottom face fringe of the lead wire holding portion 25 so as to be adjacent to one side of the lead fitting 43.
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