| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder feeding device which can surely and quickly feed a solder under a fluid state, contained in a container, to a feeding objective. SOLUTION: The solder H under the fluid state which is contained in the container 30 is fed to the feeding objective 460 by this solder feeding device 10. Such a solder feeding device 10 is equipped with a base 12, a pressing section 13, and a solder guiding member 16 having a flexible structure. In this case, the container 30 containing the solder H is placed on the base 12. The pressing section 13 applies a pressure to the solder H by pressing the container 30 along the container 30 on the base 12. The solder guiding member 16 having the flexible structure guides the solder, which is discharged from the container 30 by the pressure, to the feeding objective 460 side.
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