| 摘要 |
A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the solder wettable strips being bounded by non solder-wettable material. The microelectronic assembly also includes a composite conductive element positioned atop at least one of the conductive pads, the composite conductive element including a solid conductive core and a layer of solder material overlying the solid conductive core, the solid conductive core having a higher melting temperature than the layer of solder material.
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