| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package in which erroneous operation of a semiconductor chip due to light transmitting an interposer and generating a leak current through optical pumping is prevented. SOLUTION: The semiconductor package comprises an interposer 40, a wiring layer 50 formed on the interposer 40, a semiconductor chip 10 connected with the wiring layer 50, and a mold resin layer 62 for protecting the wiring layer 50 and the semiconductor chip 10 wherein respective lines constituting the wiring layer 50 are formed closely to each other but not to short-circuit each other and a light shielding layer 80 is formed in a region on the interposer 40 where the wiring is not formed. |
