| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC heat radiating structure that can simplify heat sink fitting work, because the structure is constituted to radiate the heat generated by an IC mounted on a circuit board by utilizing solder instead of a heat sink attached to the structure to radiate the heat. SOLUTION: This heat radiating structure of the small-sized package IC includes the circuit board having holes, the IC mounted on upper surface of the circuit board, and the solder packed in the space between the circuit board and IC through the holes and solidified. The structure also includes a soldering land which is formed on the circuit board and to which the solder can be stuck. The heat generated from the IC is transferred to the surface of the solder exposed on the lower surface of the circuit board in the holes through metallic solder which is in contact with the lower surface of the IC and the solder packed in the holes. Since the solder exposed on the lower surface of the circuit board functions as a heat sink, the heat is radiated through the solder in contact with the air. |
