SPUTTERING TARGET AND MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sputtering target of which the bonding strength between the target body and a backing plate is higher than that by soldering, and a manufacturing method therefor. SOLUTION: The target body 1 consisting of an aluminum alloy including copper and the backing plate 2 consisting of copper or a copper alloy are diffusion bonded. The sputtering target is characterized by being bonded with the backing plate 2 having a titanium layer 3 coated with titanium on the surface of a side to be bonded, through an intermediate layer 4 consisting of an aluminum-magnesium based alloy placed between the titanium layer 3 and the target body 1. The manufacturing method is characterized by the above bonding method.