| 摘要 |
PROBLEM TO BE SOLVED: To make the entire device lightweight by making a structure for mounting a plurality of semiconductor elements on one wiring board in a stacked semiconductor device. SOLUTION: The stacked semiconductor device is mounted with at least two semiconductor elements on a wiring board 10 to constitute one package CSP, the upper face peripheral part of a sealing resin 15 has a cutting part 17 by grinding, and the stacked semiconductor device has the structure with a reduced volume. Thus, the lightweight of the laminated semiconductor device constituting the plurality of the semiconductor elements 12, 14 on one package can be realized. Furthermore, since a film wiring conductor 13 is interposed between a first semiconductor element 12 and a second semiconductor element 14, the whole laminated semiconductor device has flexibility and has the structure capable of dealing with stress due to thermal expansion. |
