| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device where the reliability of a connection is improved by relaxing stress to occur due to the difference between thermal expansions of a semiconductor chip and the mounting substrate while satisfying the request on an internal connection part for installing the semiconductor chip on a circuit board and an external connection part for installing the circuit board on an external mounting substrate. SOLUTION: In a semiconductor device where the semiconductor chip (15) is internally connected to a sheet-shaped wiring circuit board having a wiring circuit (11) by a bump connection (20) and the external connection part (17) is provided on a lower surface, a flexible layer (13) is provided in at least any of the circuit board, the interval between the circuit board and the semiconductor chip, and the interval between the circuit board and the external connection part. |
