发明名称 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same |
摘要 |
A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a semiconductor chip mounted on a base film, a signal-input portion for receiving data and control signals and transmitting the data and control signals to the semiconductor chip, a plurality of passive elements connected to terminals of the semiconductor chip, and a plurality of test pads for testing one or more terminals of the semiconductor chip that are not connected to the signal-input portion. The test pads of the COF package are capable of testing a plurality of internal terminals which are integrated into one terminal and do not connected to the signal-input portion, thereby easily testing the electrical function of the chip.
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申请公布号 |
US2002139567(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20020061099 |
申请日期 |
2002.02.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM HYOUNG-HO;JUNG YE-JUNG |
分类号 |
H01L21/60;G01R31/28;G09G3/00;H01L21/66;H01L23/538;H01L23/544;H01L23/58;H05K1/00;H05K1/02;H05K1/11;H05K1/18;(IPC1-7):H05K1/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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