Noncontact IC card and fabrication method thereof

摘要

A noncontact IC card is provided with a card substrate 11, an IC chip 12 disposed on the card substrate 11, and a antenna circuit 13 formed on the card substrate 11 and having a pair of antenna terminals 13a and 13b, where one antenna terminal 13a is connected to the IC chip 12. An isolation layer 14 is formed over at least one portion of the antenna circuit 13, and a connection layer 15 is formed extending over the isolation layer 14. One end portion 15a of the connection layer 15 is connected to the IC chip 12 and another end portion 15b thereof is connected to the other antenna terminal 13b of the antenna circuit 13. Protective layers 16a and 16b are provided on top of the card substrate 11 to protect the IC chip 12 and the antenna circuit 13.