Method of wire-bonding circuit chip to bonding pad

摘要

An integrated circuit device includes a substrate with a contact unit, an integrated circuit chip with a bonding pad unit, and a bonding wire interconnecting the bonding pad unit and the contact unit. The bonding wire has a electrical bonding contact attached to the bonding pad unit, a first extension portion extending from the electrical bonding contact in a direction that inclines slightly and upwardly relative to a plane of the substrate toward the contact unit, and a second extension portion extending from the first extension portion and attached to the contact unit.