COVERING STRUCTURE OF SEMICONDUCTOR FABRICATION EQUIPMENT

摘要

PURPOSE: A covering structure of a semiconductor fabrication equipment is provided to lengthen a life time of the covering structure and reduce the fabrication of the covering structure by exchanging only an inner covering part when the inner covering structure is damaged by RFs(Radio Frequencies). CONSTITUTION: A covering structure(20) is formed with an inner covering part(12) and an outer covering part(11). The inner covering part(12) is located around an edge region of a wafer to cover an upper part of a focus ring for wrapping a static chuck electrostatic chuck. The inner covering part(12) has a shape of circular ring and is formed by quartz material. The inner covering part(12) is put in the outer covering part(11). The outer covering part(11) has a structure for covering a focus ring. The electrostatic chuck(11) has an undercoat of metallic material.