POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition giving a light-colored film after curing and less liable to discoloration even in a heat treatment process after curing. SOLUTION: The positive type photosensitive resin composition comprises 100 pts.wt. polyamide (A) of formula (I) having phenolic hydroxyl groups, 1-100 pts.wt. photosensitive diazoquinone compound (B) and 1-20 pts.wt. phosphorus compound (C).