METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a high-efficiency method for manufacturing a multilayer wiring board by which generation of cutting dust is reliably suppressed. SOLUTION: In the method for manufacturing a multilayer wiring board, an untreated multilayer wiring board which is stacked on a base supporting board is subjected to a router bit profile machining. in this case, the base supporting board is previously provided with a groove which conforms to the profile of the multilayer wiring board by machining.