| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board manufacturing method capable of preventing air from being left as voids in a viahole so as not to reduce the viahole in connection reliability when an interlayer connection is made through the viahole. SOLUTION: A single-sided conductor pattern film 21 provided with a viahole 24 and a single-sided conductor pattern film 31 are laminated and formed into a printed board 100 by thermocompression bonding. A conductive paste layer 50 is disposed on the viahole 24 provided to the printed board 100 and heated to connect a conductor pattern 22 to a conductor pattern 32. At this point, the viahole 24 is 0.5 mm or above in diameter, and the depth D of a resin film part into which the conductive paste 50 flows is set at 100μm or below, so that air can be prevented from being left as voids inside the viahole 24. |
