发明名称 |
METHOD OF SEALING WAFER BACKSIDE FOR FULL-FACE ELECTRONCHEMICAL PLATING |
摘要 |
The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier. |
申请公布号 |
WO02075792(A2) |
申请公布日期 |
2002.09.26 |
申请号 |
WO2002US06490 |
申请日期 |
2002.02.27 |
申请人 |
NUTOOL, INC. |
发明人 |
ASHJAEE, JALAL;TALIEH, HOMAYOUN;BASOL, BULENT;VOLODARSKY, KONSTANTIN |
分类号 |
B24B37/30;C25D7/12;C25D17/06;H01L21/00;H01L21/683 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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