| 摘要 |
Photosensitive insulating films are laminated and formed on lower-layer interconnection layers and a connection hole is formed in the photosensitive insulating film, and a interconnection groove is formed on the photosensitive insulating film. The upper-layer interconnection layers are formed in a manner so as to fill the connection hole and the groove. With this arrangement, it is possible to provide a semiconductor device and a manufacturing method thereof having a multi-layer interconnection structure, which have advantages in that the connection hole and a groove are formed by using a simple process, the yield can be improved and the number of processes and the costs can be reduced.
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