发明名称 Silicon carbide semiconductor device and method for manufacturing the same
摘要 In an accumulation mode MOSFET, a surface channel layer is disposed on a p- type base region between an n+ type source region and an n- type epi layer. The surface channel layer is composed of an n type channel layer formed on the p- type base region and a p type channel layer formed on the n type channel layer. A gate insulating film is formed on the p type channel layer. A channel is formed in the n type channel layer. Accordingly, channel mobility can be improved and on-resistance can be reduced without being affected by a state of an interface between the gate insulating film and the surface channel layer.
申请公布号 US6455892(B1) 申请公布日期 2002.09.24
申请号 US20000663134 申请日期 2000.09.15
申请人 DENSO CORPORATION 发明人 OKUNO EIICHI;AMANO SHINJI
分类号 H01L21/04;H01L29/12;H01L29/24;H01L29/417;H01L29/78;(IPC1-7):H01L29/94;H01L31/031 主分类号 H01L21/04
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