发明名称 |
Silicon carbide semiconductor device and method for manufacturing the same |
摘要 |
In an accumulation mode MOSFET, a surface channel layer is disposed on a p- type base region between an n+ type source region and an n- type epi layer. The surface channel layer is composed of an n type channel layer formed on the p- type base region and a p type channel layer formed on the n type channel layer. A gate insulating film is formed on the p type channel layer. A channel is formed in the n type channel layer. Accordingly, channel mobility can be improved and on-resistance can be reduced without being affected by a state of an interface between the gate insulating film and the surface channel layer.
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申请公布号 |
US6455892(B1) |
申请公布日期 |
2002.09.24 |
申请号 |
US20000663134 |
申请日期 |
2000.09.15 |
申请人 |
DENSO CORPORATION |
发明人 |
OKUNO EIICHI;AMANO SHINJI |
分类号 |
H01L21/04;H01L29/12;H01L29/24;H01L29/417;H01L29/78;(IPC1-7):H01L29/94;H01L31/031 |
主分类号 |
H01L21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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