MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated ceramic electronic component which can reduce the cost needed for a stage for parting a laminated green sheet into individual chips after thermocompression bonding. SOLUTION: When the laminated green sheet 4 after thermocompression bonding is fixed on a table 21, a DC voltage is applied to respective Peltier elements 22 and then the laminated green sheet 4 is mounted on the table 21 and fixed by freezing the moisture in the air or mounted on the table 21 after a small amount water is supplied onto the table 21 and fixed by freezing it. After virtual cutting lines are set on the laminated green sheet 4, the laminated green sheet 4 is cut with a rotating blade 6 along the virtual cutting lines and parted into individual chips.