| 摘要 |
PROBLEM TO BE SOLVED: To solve all of various defects caused by a positional deviation of an SR film coating the surface of a printed wiring board at the same time, in the printed wiring board having such a structure that a solder resist film is formed on an insulation substrate formed with a wiring pattern and the SR film of the minimum width is disposed between two conductor pads disposed adjacently to each other with a very small spacing. SOLUTION: The distance between the two adjacent conductor pads 2a is made very small, and an area of each pad is made larger a than an area necessary for bonding an electrode 10a of an electronic component. A solder resist 3 is formed with openings 20 to expose each conductor pad, and an opening area of each opening is small enough for the opening to be included in the area of the conductor pad. In a normal state in which there is no positional deviation of the solder resist, each opening stays at the center of each conductor pad, with the distance between the periphery of the opening and that of the conductor pad being equal to or smaller than the maximum positional deviation of the solder resist.
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