| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a resin-sealing method and a resin-sealing apparatus which reduces the time taken for filling and hardening an underfill resin, eliminates the generation of internal voids and simplifiers the manufacturing process and constituent components. SOLUTION: Through-holes 10 are formed in a wiring board 3, and resin is filled from a resin passage of a die assembly via the through-holes 10, and the die assembly is disassembled into an upper, medium and lower dies each being changeable to change of the resin passage, thereby coping with various type of semiconductor packages. A semiconductor chip backside is set at a position lower than that of a molded resin part. |
