STRUCTURE FOR MOUNTING MODULE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To improve the mounting density of a module substrate. SOLUTION: A plurality of module substrates 3a and 3b have circuit boards 5 (5a and 5b). The circuit boards 5a and 5b are laminated and arranged at an interval with each other. One end side of each connector 4 is connected to each circuit board 5a and 5b. The other end part of each connector 4 is connected to a connection pad 12 of a mother board 2. Thus, mounting density can be improved. The connector 4b on the circuit board 5b of an upper stage side is shaped so as to overehang from the connector 4a of the circuit board 5a on a lower side. Consequently, the connection of the connector 4a of the circuit board 5a on the lower side and the connector 4b of the circuit board 5b on the upper side is prevented.