| 摘要 |
An interposer comprising a non-conductive carrier sheet with a pre-arranged pattern of conductive interconnect members positioned therethrough and formed from an elastomeric thermoplastic with suspended spherical and non-spherical conductive particles. The non-spherical conductive particles of the present invention are positioned substantially perpendicularly to and partially through the contact faces of the interconnect member, thereby resulting in higher conductivity and efficiency. The interposer is formed by a mold comprising two sections with first and second sets of vias formed in the first and second mold sections, respectively, which permit the injected elastomer mixture to flow completely through the mold cavity and thereby aligns the non-spherical conductive particles. The exit side of the mold is further contacted by support posts of a separable mold interface creating a network of vent passages for venting of air and the elastomer mixture, resulting in less pressure within the mold and less mold flash. |
