发明名称 ASSEMBLY OF TITANIUM TARGET FOR SPUTTERING, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an assembly of titanium target for sputtering having a high jointing strength and jointing soundness, and a manufacturing method therefor. SOLUTION: This assembly has a coated film of silver or a silver alloy on the cleaned surface at a jointing side of a target, or at the both jointing sides of the target and a backing plate consisting of copper or a copper alloy, and comprises that the target and the backing plate are solid-phase diffusion jointed, making the surface having the coated film as a jointing surface. The manufacturing method comprises steps of; cleaning the surface of the jointing side; forming the coating on the cleaned surface at the jointing side; and solid- phase diffusion jointing the target and the backing plate in 0.1 Pa or less, at a temperature of 400 deg.C or more and 450 deg.C or less, under a jointing load of 40 MPa or more and 100 MPa or less, within two hours, while making the surface with the coated film as the jointing surface.
申请公布号 JP2002256427(A) 申请公布日期 2002.09.11
申请号 JP20010056913 申请日期 2001.03.01
申请人 VACUUM METALLURGICAL CO LTD 发明人 NAKADAI YASUO;KIN YUTAKA;SHIBA EIHEI;KODERA MASAHIRO
分类号 B23K35/00;B23K35/30;C23C14/34;H01L21/28;H01L21/285;(IPC1-7):C23C14/34 主分类号 B23K35/00
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