| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable wiring board wherein no micro-rack occurs in electrode-pad forming portion of an insulating board, and the connective strength of electrode pads is increased. SOLUTION: On the insulating board 1, the electrode pads 2 are formed, in each of which there are laminated in succession an adhesive metal layer 2a, a first Cu layer 2b-1 on the adhesive metal layer 2a, a second Cu layer 2b-2 on the first Cy layer 2b-1, an Ni layer 2c, and an Au layer 2d which cover the layers 2b-1, 2b-2. In each electrode pad 2, the thickness of the second Cu layer 2b-2 is made larger than the that of the first Cu layer 2b-1, and the portions of the end surfaces of the adhesive metal layer 2a and the first Cu layer 2b-1 are exposed from openings provided in the Ni layer 2c and Au layer 2d.
|
