| 摘要 |
A wire cutting method and apparatus are disclosed for use with a reflow wiring machine for interconnecting selected areas on printed circuit boards. The wire cutting apparatus functions to sever the insulated wire utilized by the reflow wiring machine after a solder joint has been completed. The wire cutting apparatus includes a shaft having a knife edge at its lower extremity positioned adjacent a reflow foot or capillary through which the insulated wire is passed. A knife actuator is connected to the shaft to lower the knife edge into contact with the wire between the solder joint and the reflow foot to sever the wire against the board surface. This results in the formation of a small wire tail located beyond the solder joint and a small wire tail extending below the reflow foot for the initiation of the next solder joint.
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