| 摘要 |
PROBLEM TO BE SOLVED: To provide a device which can quickly cool a substrate on the high temperature side. SOLUTION: This heat treatment device is equipped with a mobile cooling plate 52, which is supported capably of reciprocating between the cooling position, where it contacts wit or draws near the wafer W retained within a heat treatment furnace 10 and the waiting position, where it contacts with or draws near the reflecting plate 44 constituting the lower furnace wall of the heat treatment furnace, and a mechanism 54 winch raises and lowers its cooling plate, and is further provided with a gas inlet path 56 which introduces gas between the mobile cooling plate and the reflecting plate in the waiting position. The mobile cooling plate is shifted to the cooling position, immediately after heat treatment of the wafer, and also the gas is introduced between the mobile cooling plate and the reflecting plate through the gas inlet path at that time.
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