| 摘要 |
PROBLEM TO BE SOLVED: To firmly bond and fix a semiconductor device onto a wiring board at a low temperature. SOLUTION: A wiring conductor layer is formed. In the wiring conductor layer, five layers are successively laminated on the upper surface of an insulating board 1. The five layers include an adherent metal layer 2, a first diffusion preventing layer 3, a main conductor layer 4 made of Au, a second diffusion prevention layer 5, and an Au-Sn alloy layer that is used as a brazing material layer 6 and has a mol ratio of Au:Sn=5:95 to 15:85. |
