发明名称 High-density system
摘要 A high-density system includes a backplane, a plurality of central processing unit (CPU) cards, and a servicing control system. The backplane has a servicing input/output (I/O) bus for carrying servicing I/O data. The central processing unit (CPU) cards are plugged into the backplane and connected to the servicing I/O bus. The servicing control system includes a switching system for selectively connecting only one of the CPU cards to the servicing I/O bus, and an I/O interface module electrically connected to the servicing I/O bus. The I/O interface module comprises at least a port to which an external device may be plugged. The servicing control system selectively enables only one of the CPU cards to send servicing I/O data to the port or to receive servicing I/O data from the port.
申请公布号 US2002124121(A1) 申请公布日期 2002.09.05
申请号 US20010797672 申请日期 2001.03.05
申请人 CHEN HSIANG-CHAN;LIU HUNG-I 发明人 CHEN HSIANG-CHAN;LIU HUNG-I
分类号 G06F13/40;H05K7/14;(IPC1-7):G06F13/14 主分类号 G06F13/40
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