发明名称 Circuit board interconnection and fan-mounting assembly for convective cooling
摘要 An electronic system comprising a plurality of circuit boards and/or drives mounted in a stack within a housing. Interconnectors are provided between the circuit boards and/or drives to connect the circuit boards and/or drives and to provide vertical separations between the circuit boards and/or drives. A cooling fan is slidably disposed adjacent a wall of the housing to create a horizontal stream of air that flows through the separations and over the top and bottom surfaces of the circuit boards and/or the drives. This provides for convective cooling in an efficient manner, while minimizing the profile of the electronic system.
申请公布号 US2002122296(A1) 申请公布日期 2002.09.05
申请号 US20010800236 申请日期 2001.03.05
申请人 STONE DENNIS;VU WILLIAM;TZE RYAN;LAING RALPH 发明人 STONE DENNIS;VU WILLIAM;TZE RYAN;LAING RALPH
分类号 G06F1/18;G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/18
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