发明名称 Dielectric compositions having two steps of laminating temperatures
摘要 The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
申请公布号 US2002123540(A1) 申请公布日期 2002.09.05
申请号 US20010025346 申请日期 2001.12.18
申请人 发明人 LEE TZONG-MING;LI HSUN-TIEN;CHEN KAI-CHI;CHEN MEI-LING
分类号 C08G59/50;C08K5/17;C08L63/02;H05K3/46;(IPC1-7):C08K3/00;C08L1/00;C08L63/00;C08K5/00 主分类号 C08G59/50
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