Brazing parts forming device used for soft soldering of semiconductor chips

摘要

A tool for shaping molten solder portions (8), prior to soldering semiconductor chips onto a substrate (6), has a preferably exchangeable spring-biased punch (20) which is vertically guided on a vertically reciprocating shaft (10, 11) and which can be swivelled in all directions and friction-locked in position, spacers (24, 25) being provided on the punch (20) and extending beyond the punch face (22) for seating on the substrate (6). Preferably, the punch (20) is coupled by a ball-joint to a punch holder (30) which incorporates a heater (18) for heating the punch (20).