| 摘要 |
PROBLEM TO BE SOLVED: To reduce the warp of a TAB tape carrier, due to the thermal expansion coefficients different between a copper foil and a tape base of the carrier and the influence of the viscoelasticity of adhesives. SOLUTION: A tape base 5 with adhesives 3 is provided on one side of a polyimide resin film and punched through, as specified, and a copper foil 2 is overlaid on the tape base by a roll laminator and etched to form a wiring pattern, or in addition, a solder resist is applied to manufacture a tape carrier for TABs. In this method, prior to bonding of the foil 2, the tape base 5 is left to absorb moisture in a high-humidity atmosphere at a relative humidity of 85% or higher and then the foil 2 is bonded using the roll laminator. |
