| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring film which does not generate bubbles on leads, a semiconductor device using the same, and a system. SOLUTION: A TAB tape 11 of the flexible wiring film is connected onto a pad electrode 15 of a solid-state imaging element chip 2 for mounting a plurality of solid imaging elements via Au bumps 4. The tape 11 is laminate of an insulating base film 8, such as a polyimide film, a glass epoxy tape or the like and leads 3 of copper foils or the like, formed with anchoring holes 6. The leads 3 are connected to the bumps 4 at distal ends 3c of inner leads 3a. Outer leads 3b are laminated on the film 8. The chip 2 is provided in a device hole 10, having no insulating base film 8 in a state in which the chip 2 is connected to a cover glass 1 with a thin film having a different refractive index called an 'AR coat'. |
