发明名称 THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To provide a thermal head in which a bonding wire forms normal looping, and a wiring failure by direct contact between the bonding wire and an electrode pattern can be prevented. SOLUTION: There are set a plurality of heating resistors arranged on a glaze layer 2, a plurality of electrode patterns 5 each arranged on the glaze layer 2 and having one end connected to the heating resistor, a driver IC arranged on the glaze layer 2 for controlling driving the heating resistors, a plurality of electrode pads 7 connected to the other ends of the electrode patterns 5 respectively and arranged in a plurality of arrays to the driver IC, a photosensitive insulating film 8 exposing the electrode pads 7 and having a thickness of 0.5-5μm by which the electrode patterns 5 set in the periphery of the electrode pads 7 are covered, and the bonding wire 9 for connecting the electrode pads 7 and the driver IC with each other.
申请公布号 JP2002240336(A) 申请公布日期 2002.08.28
申请号 JP20010039890 申请日期 2001.02.16
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 UZUKA RYUICHI;MORI HIDEAKI;OBA MASATO;NAKAMIGI JUNGO
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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