发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method capable of improving productivity, and forming a marginal region for executing laser trimming excellently without enlarging a circuit board, concerning the semiconductor device equipped with the circuit board for executing resistance value adjustment by laser trimming. SOLUTION: In this semiconductor device A equipped with the circuit board 5 connected electrically to a semiconductor sensor 4, and having a plurality of trimming resistances Ra-Rf for adjusting the output from the semiconductor sensor 4, the trimming resistances Ra-Rf are disposed in rows on the circuit board 5, and the marginal region 11 for enabling trimming to each trimming resistance on both side is provided between the trimming resistances Ra-Rf.
申请公布号 JP2002243565(A) 申请公布日期 2002.08.28
申请号 JP20010036714 申请日期 2001.02.14
申请人 NIPPON SEIKI CO LTD 发明人 SATO SHUJI;TOMII JUNRO
分类号 G01L9/04;G01L9/00;H01L29/84;H05K1/16;(IPC1-7):G01L9/04 主分类号 G01L9/04
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