发明名称 Method of forming a contact structure in a semiconductor device
摘要 Annular and linear contact structures are described which exhibit a greatly reduced susceptibility to process deviations caused by lithographic and deposition variations than does a conventional circular contact plug. In one embodiment, a standard conductive material such as carbon or titanium nitride is used to form the contact. In an alternative embodiment, a memory material itself is used to form the contact. These contact structures may be made by various processes, including chemical mechanical planarization and facet etching.
申请公布号 US6440837(B1) 申请公布日期 2002.08.27
申请号 US20000617297 申请日期 2000.07.14
申请人 MICRON TECHNOLOGY, INC. 发明人 HARSHFIELD STEVEN T.
分类号 H01L21/4763;H01L45/00;(IPC1-7):H01L21/476 主分类号 H01L21/4763
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