| 摘要 |
PROBLEM TO BE SOLVED: To efficiently dry a substrate, such as a wafer, in a short time by a vacuum spin dryer method for drying the substrate and a vacuum spin dryer device. SOLUTION: The vacuum spin dryer method is a method to dry a substrate set on a rotor within a dryer by rotating the rotor and, composed of a process for gradually reducing a pressure within the dryer and a process for intermittently introducing an inert gas within the dryer. A water content in the substrate is turned into a mist by a synergistic effect due to a centrifugal force, a blowing-off due to the inert gas and a reduced pressure to enable to efficiently remove the water content and the substrate can be completely dried.
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