发明名称 Substrate heating method
摘要 In the heating of a substrate in a lithographic process, temperature conditions for heating a substrate on which a resist is formed exert a large influence upon the pattern dimensions, and the pattern dimensions vary greatly in the heating from only one of the surfaces of the substrate. There is provided a substrate heating apparatus for heating a substrate before or after irradiation of light for performing a pattern by using a photosensitive material formed on a substrate or by using a material which is photosensitive to charged particles formed on the substrate. The substrate heating apparatus includes an upper heater which serves as a heat source for heating the substrate from the top surface thereof, a lower heater which serves as a heat source for heating the substrate from the bottom surface thereof, and a heat-conducting heater block provided on the lower heater, on which heater block the substrate is placed, making it possible to individually set the temperatures of the upper and lower heaters.
申请公布号 US6436482(B2) 申请公布日期 2002.08.20
申请号 US19960769899 申请日期 1996.12.19
申请人 SONY CORPORATION 发明人 KATSUMATA MIKIO
分类号 G03F1/08;G03F7/20;H01L21/00;H01L21/027;(IPC1-7):C08J7/18;B05D3/02;B05D3/06 主分类号 G03F1/08
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