| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part device capable of efficiently preventing the occurrence of cracks and the failure of Ag migration of a conductor land in a temperature cycle test or the like. SOLUTION: In the electronic part device 10 arranging at least four conductor lands 2 on a substrate mounting face along the corner part of the arrangement area of a substantially rectangular conductor land and bonded through solder 5 so that a ceramic substrate 1 connecting a via hole conductor 3 extending in the direction of the thickness of the substrate on each conductor land 2, respectively, and a mounting substrate 6 forming a land electrode 7 on a loading face are connected to the conductor land 2 and the land electrode 7, the connection position of the via hole conductor 3 in the conductor land 2 of the ceramic substrate 1 is at the most separated corner part in the radial direction from a circle center in the conductor land by making the center O of the arrangement area of the rectangular conductor land the circle center.
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