| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable package capable of effectively preventing generation of a void in underfill material while making the package small and thin. SOLUTION: In the package for a piezoelectric device which has a base and a cover connected to the base and seals hermetically an IC element and a piezoelectric vibrating reed inside the piezoelectric device, the IC element is mounted on a mounting face by flip-chip bonding and is also fixed by the underfill material on the base, a venting hole communicating to the outside of the package is opened on the mounting face, and the vent hole is also closed hermetically from the outside of the package. Air and the other gases are discharged completely from a gap between the lower face of an IC chip and the base mounting face when the underfill material is filled, voids in the underfill material are effectively prevented from being generated though the gap is made narrow and small and the pitch of a bump is made narrow, and therefore, a highly reliable piezoelectric device and other electronic devices are realized.
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