| 摘要 |
PROBLEM TO BE SOLVED: To provide a resistor connector which varies little in resistance value than usual in an environment where an ambient temperature changes sharply and is improved in manufacturing yield. SOLUTION: The resistor connector C is composed of a pair of lead frames 1 and 1, a resistor unit 10 positioned between the lead frames 1 and 1, silicone resin buffer layers 20, and a molded cover 2 covering the resistor unit 10 through the intermediary of the silicone resin layers 20. Thermal stress caused by a molding pressure and a temperature change is relaxed by the buffer layers 20, so that a resistor 12 can be protected against the occurrence and growth of cracking. Therefore, the resistor 12 varies little in resistance value. Sn-Ag eutectic solder is used as solder (b), so that a soldered joint is improved in bonding strength. The solder (b) has a higher reflow temperature than Sn-Pb eutectic solder, so that the volatilization of a flux volatile component is promoted. Therefore, troubles caused by a flux volatile component can be eliminated, so that the resistor connector C can be improved in yield. |
