| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable circuit board with no crack while a conductor pattern exposed from a protecting film has no flaw. SOLUTION: There are provided an insulating substrate 11, conductor patterns such as an image identification marker 17 provided on one main surface of the insulating substrate 11, protecting patterns 21 and 23, and a protecting film 19 which covers parts of the protecting patterns 21 and 23 as well as the conductor pattern 17. The protecting patterns 21 and 23 are provided on the insulating substrate 11 closer to an end surface side than the conductor pattern 17. A metal film 41 is formed on the other main surface. The surface of protective film 19 above the protecting patterns 21 and 23 is higher than the surface of conductor pattern 17 which is not covered with the protecting film 19, by a thickness of the protecting film 19. The protecting patterns 21 and 23 as well as the protecting film 19 above them constitute a stopper when punching out.
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