发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent color mixing, smear, and the like by limiting the move of a signal charge between adjacent photosensor sections. SOLUTION: An annular intralyer insulating film 100 for surrounding a lower- layer region of each photosensor section 120 is provided at the middle layer of a semiconductor substrate 110, thus setting the position of an overflow barrier 180 deeper at the lower-layer region of each photosensor section 120, and shallower at the surrounding region. The shallow region of the overflow barrier 180 functions as a crosswise barrier 180B. For example, light obliquely entering the photosensor section 120 is subject to photoelectric conversion at a position exceeding the crosswise barrier 180B in the lower-layer direction and is swept to further lower layer of the semiconductor substrate 110, thus preventing an electric charge from moving to an adjacent pixel. Also, at the lower-layer region of each photosensor section 120, sufficient sensitivity is obtained at the deep overflow barrier 180.
申请公布号 JP2002231924(A) 申请公布日期 2002.08.16
申请号 JP20010021172 申请日期 2001.01.30
申请人 SONY CORP 发明人 KOMATSU EIJI
分类号 H01L27/148;H04N1/028;H04N5/335;H04N5/359;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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