发明名称 PACKING METHOD FOR SEMICONDUCTIVE SEAMLESS BELT AND PACKING CONTAINER THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a packing method for a semiconductive seamless belt and a packing container therefor, capable of reducing the cost of transport and preventing an abrasion or the like from being caused by the sliding movement of the seamless belt during transport by means of simple packing work. SOLUTION: The packing method for a semiconductive seamless belt 1 which has flexibility and whose surface resistivity is made to be 108-1013Ω/(square) holds the seamless belt 1 in a container 10 or on a frame body, under the condition that the closest distance to the inner peripheral faces 1a of the seamless belt 1 is made to be at most half of its diameter when it stands cylindrically upright.
申请公布号 JP2002225971(A) 申请公布日期 2002.08.14
申请号 JP20010026394 申请日期 2001.02.02
申请人 NITTO DENKO CORP 发明人 ISHIZAKI SATORU;ASAGAMI AKIRA
分类号 G03G15/16;B65D85/67;G03G5/00;G03G5/10;G03G15/20;G03G21/00;(IPC1-7):B65D85/67 主分类号 G03G15/16
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