COPPER ALLOY FOIL FOR LAMINATED BOARD

摘要

PROBLEM TO BE SOLVED: To provide copper alloy foil for a laminated board which has a smooth surface, and in which direct bonding with polyimide is possible without applying a roughening plating treatment of a printed circuit board using polyimide. SOLUTION: The copper alloy foil for a laminated board has the components of additional elements containing one or more kinds selected from 0.01 to 2.0 mass% Cr and 0.01 to 1.0 mass% Zr, and the balance copper with inevitable impurities. Its tensile strength is controlled to >=600 N/mm2 electric conductivity to >=50%IACS, and surface roughness to <=2μm by the ten point average surface roughness (Rz), so that the 180 deg. peel strength of the copper alloy foil when directly joined with a polyimide film without applying roughening plating treatment is >=8.0 N/cm.