| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin for sealing a photosemiconductor having excellent transparency, soldering resistance and releasability, and also to provide a photosemiconductor device sealed with its cured product. SOLUTION: This epoxy resin composition for sealing photosemiconductor contains as an essential component (A) an epoxy resin having two or more epoxy groups in one molecule, (B) an acid anhydride curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a releasing agent. The internal-mold releasing agent (E) is represented by the general formula: CH3(CH2)kCH2 O-(CHR1-CHR2-O)m(CH2-CH2-O)n-H [wherein, k denotes a value of 40 to 60; m denotes a value of 1 to 5; n denotes a value of 15 to 45; R1 and R2 are each H or a monovalent alkyl group, and at least one of which is the monovalent alkyl group]. The photosemiconductor device is sealed with its cured product.
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