CHIP SCALE PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A chip scale package(CSP) is provided to miniaturize the structure of the CSP and to improve heat radiating capacity and reliability, by using high-reliable subsidiary material. CONSTITUTION: A wire bonding pad is formed on a circuit tape(2). A circuit interconnection and a solder land(5) connected to the wire bonding pad are formed on the bottom surface of the circuit tape. A semiconductor chip(1) is attached to the upper surface of the circuit tape. A wire(7) connects a chip pad of the semiconductor chip with the wire bonding pad of the circuit tape. A mold body(8) is formed on the circuit tape to encapsulate the semiconductor chip and the wire.