| 摘要 |
Herein is disclosed an apparatus for vacuum lamination of an adhesive film wherein the resin composition layer of an adhesive film is vacuum laminated continuously on the patterned part of a circuit board by heating and pressing conditions with the use of a heat-resistant rubber roll, said heat-resistant rubber roll being wider than said adhesive film, and having concave parts or notch parts corresponding to the width of the adhesive film to be placed and on the surfaces in the vicinity of both the ends of the roll. The present invention relates to an apparatus and method for vacuum lamination of an adhesive film wherein the problem of fouling a laminating roll caused by the seepage of the resin composition from an adhesive film for circuit board lamination can be obviated, whereby the problem of fouling a laminating roll caused by the seepage of the resin composition from an adhesive film for circuit board lamination at the lamination can be solved. |
